The NanoSpec 8000X and 8000XSE (includingSpectroscopic Ellipsometer) are members of a family of powerful, fully automated, multiple-mode film analysis tools for in-process control of thickness and composition of films on wafers. Two basic platforms are used, one for wafers between 75mm and 200mm - the NanoSpec 8000X, and the other for 200mm and 300mm diameter wafers - the
NanoSpec 8300X.
Unmatched flexibility for semiconductor and magnetic head applications!
The Model 8000 X design allows the tool to be configured to meet the needs of specific applications. Certain sub-systems, such as a small spot spectroscopic ellipsometer, SMIF handler and minienvironment are available as options. The 8000X is also the ideal tool for magnetic head manufacturing applications.
Programs have been developed for the film and substrate combinations used in this industry and the robot can handle pucks of varying size and shape.
The NanoSpec 8300 X was designed to meet the needs of IC manufacturers who are currently using 200mm wafers, but plan a move to 300mm.
For companies engaged in the development of new 300mm manufacturing equipment, used to produce or modify thin films, the 8300X offers the capability of characterizing film processing during development.