SEMICONDUCTOR SURPLUS EQUIPMENT FOR SALE

Olympus microscope with LM Plan Fi 5x/10x/20x/50x Objectives, Brightfield/Darkfield, Transmitted light viewing with a Model U-LH100-3 12V,100W lightsource.Trinocular viewing head with WH10x-H22 eyepieces, Nikon LWD 0.65 base objective, U-DICR slide objective, U-AN360 slide and U-PO slide. JVC TK C1380 Color video camera with adaptor & monitor, 10.5 x 6 stage with 4x4 travel.

Motion controller system can drive all of Kensington's motion control products. Tested. Conditions: Excellent, refurbished with 6 month warranty. Inquire about custom configuration for your tool.

Model: WTM-511-2-FWS02-V1-CU.

PRI AUTOMATION ABM-405-1-CE-S293 ROBOT

Model#: 001-6300-03.

Model: 3L7059857.

Model: 3L7059857.

P/N: 990010661.

Combines a high-resolution optical system with high-precision mechanics to yield the greatest overall performance available. New. Standard Warranty.

KLA Part#: ESC-212-KLA-UNI. New. Tested. Refurbished with 6 month warranty. Inquire about custom configuration for your tool.

Designed for handling wafers or reticles up to 300mm in diameter. Class 1 clean room compatible. Available with CE Mark. Macro programmable. Intelligent commands. New.

Completely refurbished with 6 month warranty. Upgrades include new power supply, monitor, graphics printer, CCD camera.

Single wafer downstream micro-wave ashing system. 75 - 150mm wafer capacity. Small footprint 32"W x 32" L x 28" H. Pick and place wafer handling. 2u to 5u/min. positive resist ash rates. Particle control less than .05p/cm2 > 0.3u gate oxide. Uniformity +- 5-20%. Throughput up to 90wph. SECS 11 interface, multiple process step capability.

Spinner Up to 10,000 rpm, for relatively light loads such as silicon wafers, small photomasks, etc, 7.9-inch I.D., reduced by a removable splash deflector to a maximum recommended substrate dimension of 5 inches. For a 5-inch diameter or diagonal substrate -p/n 2-21073 & 9-22662. The R790 motor package has two drain lines from the stainless steel bowl. PWM32 Controller, Auto vaccuum button -p/n PW3-23231, Lid/auto open close switch, Body - p/n 3-18277 115V, 50/60Hz.

Resist Spinner Dispense Controller EC-102 S/N 11528.

Intensity meter.

Thin Film Stress measurement system. Windows based PC, monitor & keyboard. Temperature capable of up to 600 degrees C. 208V, single phase.

Previously owned model 7700 Surfscan system capable of up to 200mm wafers. System will be configured per your wafer size. Patterned & Unpatterned Surface Inspection System. Can detect as small as 0.15 micron, while defects below 0.2 micron can be detected on many process levels, such as Nitride, Oxide, Polysilicon, TEOS films. High sensitivity on after etch and high topography applications. Accuracy within 1% XY coordinates System will meet OEM specification. Manuals included. Calibration standards not included (can be supplied at an additional expense).

Previously owned unit with Microscope review station, capable of up to 200mm wafers. System will be configured per your wafer size. Patterned & Unpatterned Surface Inspection System. System will meet OEM specifications. Manuals included. Calibration standards not included (can be supplied at an additional expense).

Surface Contamination Analyser Model# 4500. Non-patterned wafer inspection capable of up to 6" wafers (150mm). Will configure for 2" wafers capabilities, including 2" pan assembly, realignment, calibration, cassette elevator modification. Sensitivity 0.21um, defect detection 0.4 ppm. Haze Sensitivity Accuracy within 1%. Color Histograms/bit maps. System will meet OEM specifications. System will be NIST Calibrated (calibration standards are not included with system). Operators Manual included.

Capable of up to 200mm wafers. Currently configured for 200mm wafers with PA-172 cassettes. Blue light laser for Non-Patterned Surface Inspection System. 0.117 micron Defect Sensitivity @ 95% capture, based on PSL Standards 0.02 ppm Haze Sensitivity 0.002 ppm. Haze Resolution Accuracy within 1% using approved VLSI Standard.

Capable of up to 200mm wafers. Currently configured for 200mm wafers with PA-172 cassettes. Red light laser for Non-Patterned Surface Inspection System. 0.15 micron Defect Sensitivity @ 95% capture, based on PSL Standards. 0.02 ppm Haze Sensitivity 0.002 ppm Haze Resolution Accuracy within 1% using approved VLSI Standard.

Long Scan Profiler Scan, length: 8.1 inches. Scan speed: 1 um/sec to 25mm/sec. Sampling rate: 50,100,200,500,1000 sample/sec. Nominal Vertical Linearity: +/-0.5% above 2000A Measurement Head Stylus control: Programmable force range 1.0-50mg. Vertical range: up to 300um. Variable sample image magnification. Side view optics 150-600x. Top view optics 185-750x.

Model 500 Stylus-based surface profiler adjustable between 1 and 100mg, Zoom optics with magnification up to 210x, Multi-scan average mode scans up to 10 times and then averages the scan before print out, Powerful Data Analysis w/ up to 30 standard surface parameters selections, Accurate Surface Characterisitic Measurement with resolution to 1A, 2D step height metrology profiling with guaranteed 10A (1s) or 0.1% repeatability, Enables R&D and QA process control with step height metrology below 50 nm to 300 µm, Environmentl Interference protection hood, Exports data as ASCII file.

Digital Semi-Automatic Ball Bonder 200 program storage capability with digital display of all bonding parameters, 9 inch diameter bonding area and negative EFO flame-off. Heated workholder with clamp mechanism and adjustable height. Intralux 4000-1 light source. Leica MZ6 microscope with 16x/14B eyepieces, & manual Z. 115V, 50/60 Hz.

Plasma Etch system, with two shelves, 12" x 12" x 20" Stainless Steel Chamber 26" x 20" x 30.5" exterior dimensions, two MFCs with capabilities of up to four, Advanced Energy RFX-600 600w Rf 13.56 mhz power supply with auto-tuning. Forward/reflected power Microprocessor controlled 220V, 20A, 50/60Hz, single phase.

Thin film thickness measurement system for transparent films on 75mm to 150mm wafers, measures 14 standard film types including photoresists, polyimides, polysilicon, oxides, and nitrides in ranges from 100A to 500kA. Typical measurement time 2.5 seconds.

Reflected light inspection microscope configured for brightfield/darkfield observation, trinocular viewing head, CF Plan 5x/DIC WD 12.0 objective, CF Plan 10x EPI WD 15.5, CF Plan 20x/50x EPI ELWD objectives, 10.5 x 6.25 xy coaxial stage with "4" x 4travel, JVC TK-C1380U color video camera with adaptor & monitor. 100-120V, 2.4 amps, 50/60 Hz.

Olympus microscope with UM Plan 5x/10x FL brightfield/darkfield & LM Plan 20x/50x/100x FL brightfield/darkfied objectives, trinocular viewing head with WH10x-H22 eyepieces, Nikon LWD 0.65 base objective, U-DICR slide objective, U-AN360 slide and U-PO slide. JVC TK C1380 Color video camera with adaptor & monitor, 10.5 x 6 stage with 4x4 travel,Model U-LH100-3 100W lightsource.

RIE (Reactive Ion Etch) System w/endpoint detector. 8" electrode, RIE (lower electrode only) RFPP - RF5S power supply, Leybold 151C turbo, Neslab/RTE 111 Chillers, (6) MKS MFCs, Non-Clorine based system with N2 purge, End point detector. 208V, 3 phase, 60Hz.

Film Thickness Mapping System for un-patterned wafers C2C Handler 2mm size spot for up to 625 locations per wafer. Contour maps are displayed & can be printed 3-D plots & diameter scans. Capable of up to 200mm wafers. Printer included.

Reconditioned Film Thickness Measurement System Designed for Mapping Thin Dielectric Films and resist. Fully automated film thickness mapping system. Mapping of dielectric films from 200A to 4um. Mapping of resist from 500A to 4um Mapping Die, Contour, 3-D maps Scanning Diameter scan System meets all OEM specifications.

Sheet Resistivity mapping System. Capable generating contour maps, 3D maps, or diameter scan of up to 625 points,for 2"- 8" wafers.

6 Pocket E-Beam Evaporator, CTI 8 cryo & compressor, IonTec MPS-3000 FC, MKS 246, IC-5 Deposition Controller, Temescal sweep controller, CV8, Temescal SRT-402 pocket controller, Edwards 40 mechanical pump. 208V, 70A, 3 Phase, 60 Hz.

Spectroscopic Ellipsometer 415-750nm w/44 channels LPS-400: 75W Xenon Light Source ST-260: Sample Translation module EC-270: Electronic Control module Computer, Monitor & keyboard.

HMDS Oven, Micromaster,Athena Controller, 12"x12"x12" Stainless steel chamber, flask & 7cfm pump.