KLA-TENCOR 4500 WAFER INSPECTION SYSTEM REFURBISHED

System Specifications:

• Capable of 2"-6" wafers. Set up for 4-5-6 inch wafers.
• Substrate Thickness: Semi standard thickness.
• Material Type: In the most sensitive range, any opaque, polished surface that scatters less than 0.025% of incident collimated light averaged over the substrate.
• High angle optics.
• Currently configured for 4-5-6 inch wafers, PA-172 Cassettes.
• Non-patterned surface Inspection System.
• Defect Sensitivity, 0.2 micron or approximately 0.015 micron squared. Based on 95% capture on silicon PSL Standards.
• 0.4 ppm Haze Sensitivity.Contamination: No more than 2
• particles with scattering cross-section greater than 0.5 micron squared per 50 passes, 96% confidence.
• Accuracy within 1% measured on a VLSI Relative Standard 1402.
• Refurbished to OEM specifications.
• New HeNe laser, 632 nanometer.
• New Color Monitor.
• NIST Calibrated.
• Full Calibration data package.
• New 80 column Printer.
• Manuals.
• USA Shipping Crate.