ESTEK WIS-850 II REFURBISHED

System Specifications:

• Detection 0.12 um on Silicon at 95% capture rate. Verified by NIST Standards.
• 2 to 8 inch capable with proper setup. Current configuration is 4 to 8 inch.
• Dark and light channel system. Dark channel is used for detecting particles and any light scattering defects. Light channel is useful for detecting non-light scattering defects such as mounds, dimples and non uniformity. Detects specular flaws, including large particles, mounds, dimples, saw marks, grooves, fractures, slip, epi-spikes, small particles on large grained surfaces, particles buried in/under a film.
• Argon Ion 488nm laser.
• Remanufactured System to factory production specifications.
• NIST Calibration.
• Warranty 90 days, Parts and labor. Travel Expense not included.
• Automatic cassette-to-cassette robotic wafer transport system.
• Non-contaminating robotic wafer handling system with sorting capability.
• Wis-850-II D model/ includes two random access stages. Wafers per hour, 120.
• Wis-850-II C model/ includes two random access stages and 4 receive stages. Wafers per hour, 180.
• Configured to run Fluoroware PA-72 Series Cassette
• Data printer.
• New Color Monitor to display wafers.
• No haze reporting channel.